Dynatron Q5 Active 2U Cooler Intel 1700 -RoHS

Dynatron Q5 — Active Cooler for 2U Servers

Cooling powerful processors in servers and compact systems requires precision engineering and reliable performance. The Dynatron Q5 is an active cooler designed for Intel® Alder Lake S processors on the LGA 1700 socket, ideal for servers with a height of 2U and above. Thanks to its copper base and aluminum fins with integrated heat pipes, it efficiently dissipates heat up to TDP 125 W, ensuring stable operation even under high loads. The compact dimensions of 90.7 x 85.0 x 65.1 mm allow for easy integration into a wide range of devices.

Powerful Cooling and Efficiency

This cooler features a copper base and aluminum fins with integrated heat pipes that maximize heat dissipation directly from the processor. The active fan with dimensions 60 x 60 x 25 mm provides flexible speed from 1600 RPM at low load to 8000 RPM at maximum power. This dynamic range allows the cooler to adapt to current needs, thereby reducing noise and optimizing energy consumption.

Low noise and high air flow

The Dynatron Q5 fan achieves an air flow of up to 46.41 CFM at maximum speed, ensuring effective cooling even in demanding conditions. The noise level ranges between 18 dBA at low load and 52.94 dBA at maximum speed. This makes the cooler suitable even for environments where noise control is important.

Technical details for compatibility

• Fan voltage: 12 V
• Power consumption: 1.20 W (0-20% load), 2.28 W (50% load), 7.2 W (100% load)
• Static pressure: 0.76 mm-H2O (0-20%), 4.76 mm-H2O (50%), 19.04 mm-H2O (100%)
• Pinout:
• Pin 1: Black (-)
• Pin 2: Yellow (+)
• Pin 3: Green (Tachometer/Signal output)
• Pin 4: Blue (PWM)

Thanks to these features, the cooler is fully compatible with modern Intel processors on the LGA 1700 socket and easily integrated into various server builds.

Pre-installed thermal paste

The cooler comes with pre-printed thermal paste, making it easy to install quickly and reliably without the need for additional preparation. This detail ensures optimal heat transfer between the processor and the cooler from the first start.