Dynatron N7 1U Passive Cooler for Intel 4189 up to 205W

Dynatron N7 — Passive Cooler for 1U Servers

Efficient cooling is key for high-performance servers, especially in compact devices such as blade servers and 1U rack servers. Designed for Intel® Ice Lake and Cooper Lake processors with the FCLGA 4189-4/5 (Socket P4/P5 or P+) socket, the Dynatron N7 can handle thermal loads of up to 205 W, ensuring efficient heat dissipation even under maximum load. With a high-quality copper (Copper 1100) construction, it provides excellent thermal conductivity, which extends the lifespan of the hardware and increases its reliability.

Design and materials for optimal cooling

The Dynatron N7 is equipped with a vapor chamber base and fins, both made of Copper 1100, which is known for its high thermal conductivity. This design effectively transfers heat away from the processor and minimizes the risk of overheating. Pre-applied Shin-Etsu 7762 thermal paste facilitates installation and ensures optimal contact area between the processor and the heatsink, which is especially important in server environments where stability is a priority.

Compatibility and use in servers

The Dynatron N7 heatsink is specifically designed for blade servers and 1U rack servers. With its compact dimensions of 113 x 78 x 25 mm and weight of 400 g, it is easy to integrate into server systems with limited space. Its design meets the requirements for low-profile cooling, allowing efficient airflow in densely packed server cabinets.

Technical data

• Supported processors: Intel® Ice Lake and Cooper Lake Server Processor
• Processor socket: FCLGA 4189-4/5 (Socket P4/P5 or P+)
• Maximum heat dissipation (TDP): 205 W
• Material: 1100 copper (base and fin)
• Thermal paste: Shin-Etsu 7762, pre-applied
• Dimensions: 113 x 78 x 25 mm
• Weight: 400 g

Package contents

• Dynatron N7 passive heatsink
• Pre-applied Shin-Etsu 7762 thermal paste